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Analyzer

Laser flaw inspection & measurement device

Realize automated visual inspection in the factory!

The only device manufacturer in Japan that has both laser scratch inspection and measurement technology

Already sold more than 450 devices

Consistent support from pre-installation design to after-sales operation

What is an ANALYZER?

ANALYZER is a laser inspection and measurement device for bore holes. 

ANALYZER laser inspection allows judgment by the change in reflection light. ANALYZER helically scans the inner wall of a cylindrical shape with a laser beam, and digitizes and logs the strength of reflection. The reflection will vary at an irregular part. ANALYZER picks up a part which has extremely different strengths of reflection as a defect candidate; and automatically makes the quality decision based on the limits (size, etc.) set. 

ANALYZER inspects the inner diameters of holes in a non-destructive, non-contact method using a laser beam. A standard 200mm ANALYZER probe inspects the inside of bore holes that are visually inaccessible. (longer lengths available on request).

ANALYZER automates the making of judgement by setting a threshold. All data are stored and available for feedbacks to make corrections or improvements. Installable as a part of an automated production process. The deeper depth of focus enables handling different diameters without adjustment.

ANALYZER inspection process

Examples of detected defects

Detected scratch
Detected blow hole
Detected burrs
Detected blow hole cluster
(Typically, a tiny blow hole - indicated by a red cross - isn't a defect. However, this group of small blow holes within a specified diameter makes the inspection area fail)

These are the examples of inner wall surface detection for aluminum casting. Any materials that reflect laser light such as aluminum, iron, stainless steel, ceramic, resin, plastic, etc. can be inspected.

Inspectable workpieces

Valve body, Engine block, Valve sleeve, Piston, Master cylinder, Cylinder block, Cylinder sleeve, Mission housing, Inverter case, Coverter case, Pistons, Wheel cylinder, Impeller, Oil pump, Cylinder head cover, Engine cover, Rocker arm pin, etc.

Detectable defects

Blow holes, Porosities, Scratches, Burrs, Peelings, Chatter marks, Chips, Dents, Burrows, etc.

Work materials

Aluminium, Stainless steel, Copper, Titanium, Ceramic, Resin, Plastic etc.

Benefits of using ANALYZER

  • Reduce labor costs with automated inspection
  • Standardize inspection quality based on facts and numerical standards
  • Prevent false NG products due to excessive quality requirements
  • Improve work efficiency by shortening inspection time

Frequently asked questions about ANALYZER

Why ANALYZER differs from other inspection systems?

  • Compared to visual inspection
    ANALYZER eliminates human errors (careless mistakes), and provides constant inspection performance
  • Compared to camera-inspection
    ANALYZER doesn’t require light, and not affected by external disturbance caused by light
  • Compared to eddy current flaw detection
    ANALYZER can make a judgment by the shape and/or the size
  • Compared to capacitive methods
    ANALYZER allows relatively rough positioning

How quickly does ANALYZER inspect?

The inspection speed is around 4 seconds per 100 mm, derived from the feed rate of the probe.
It’s possible to speed up the inspection depending on the size of the defect.
Using the free sample test, proper inspection speed can be determined.

What is the smallest defect size ANALYZER can detect?

The guaranteed accuracy is 0.2mm.
Smaller defects can be detected by manipulating the threshold, although some stains may be detected as defects due to the surface condition such as cleanliness or polishing (finishing).

What is accuracy of the repeatability?

The repeat positioning accuracy is ±1 pixel; enough to stabilize inspection.

Is the detected size and the real size the same?

 A. Analyzer
image		B. Electron
microscope
X1.902.058
Y1.101.168
Aspect ratio0.580.57
 A. Analyzer
image		B. Electron
microscope
X1.000.953
Y1.801.742
Aspect ratio1.801.83

Case studies for ANALYZER

Valve body blowhole inspection

The valve body is a part used in automatic cars. It is the heart that controls the shift. If this part gets defected, heavy shift shock may occur. The valve body has multiple holes with different diameters, and this device inspects the wall surface of the holes to check defects.
  • Inspection man-hours reduced by 65%
  • 18 inspectors reduced

Inspection procedure

  1. Set work in the device
  2. Center the probe and workpiece in the machining center
  3. Inspect the inner wall and make an OK / NG judgment
  4. Repeat steps 2 and 3 with multiple holes to make the final judgment
  5. Discharge work

Usage environment

Device installation location In the factory line
Probe used Probe rotation type SG-LSDC-6-203
Main inspection Blowhole, scratches, cracks, dents, etc.
Inspection target diameter
/ measurement length		 Φ8～15mm
L=40～80mm
Takt time About 10sec (10holes inspection)

Engine block blowhole inspection

It is used to inspect the main parts of car engines.
  • 23% reduction in inspection man-hours
  • Reduction in defective product outflow rate
Inspection procedure
  1. Work is transported by a belt conveyor.
  2. Decide the work position in the stage and lift up.
  3. Inspect the inner wall and make an OK / NG judgment.
  4. OK products will go to the subsequent process,NG products will be re-inspected visually.

Usage environment

Device installation locationIn the factory line
Probe usedProbe rotation type SG-LSDC-8-190
Main inspectionBlowhole, scratches, cracks, dents, etc.
Inspection target diameter /
measurement length		Φ80mm
L=120mm
Takt timeAbout 40sec (4holes inspection)

Sleeve blowhole inspection

  • Inspection man-hours reduced by 73%
  • 6 inspectors reduced

Inspection procedure

  1. Transport the work in the index table.
  2. Inspect the inner wall and make an OK / NG judgment.
  3. OK products will go to the subsequent process, NG products will be discharged by each defect type.

Usage environment

Device installation locationIn the factory line
Probe usedProbe rotation type SG-LSDC-6-203
Main inspectionBlowhole, scratches, cracks, dents, etc.
Inspection target diameter /
measurement length		Φ12mm　
L=65mm
Takt timeAbout 5sec/work

Inspection of screw holes in the differential case

Inspection procedure
  1. Person sets the work by hand and push the start lever.
  2. The inspection starts as soon as the shutter closes.
  3. Inspect 12 screw holes while turning the workpiece on the index table.

Usage environment

Device installation locationIn the factory line
Probe usedProbe rotation type SG-LSDC-6-203
Main inspectionBlowhole
Inspection target diameter /
measurement length		M11mm　
L=20mm
Takt timeAbout 45sec(12 screw holes inspection)

Impeller scratch inspection

Inspection procedure
  1. Set the work on the station with a 6-axis robot.
  2. The inner diameter of the shaft hole of the impeller is inspected to determine OK / NG.
  3. OK products will go to the subsequent process, NG products will be re-inspected visually.

Usage environment

Device installation locationIn the factory line
Probe usedProbe rotation type SG-LSDC-2.3-50
Main inspectionScratch
Inspection target diameter /
measurement length		Φ5mm　
L=60mm
Takt timeAbout 15sec/work

Bearing roughness residue inspection

Inspection procedure
  1. Transport the work in the index table.
  2. The inner(outer) diameter is inspected and determine OK / NG.
  3. OK products will go to the subsequent process,NG products will be re-inspected visually.

Usage environment

Device installation locationIn the factory line
Probe used
  • Probe rotation type SG-LSDC-8-50
  • Probe rotation type SG-LSRA
Main inspectionRoughness residue
Inspection target diameter /
measurement length		Φ30mm　
L=15mm
Takt timeAbout 4sec

Rocker arm pins scratch inspection

Inspection procedure

  1. The work is put into the rail from the parts feeder and rolled by the weight of the work.
  2. Stop the work at the inspection position, clamp both ends of the work, and rotate the work at high speed.
  3. Inspect the outer wall and make an OK / NG judgment.
  4. OK products will go to the subsequent process, NG products will be re-inspected visually.

Usage environment

Device installation locationIn the factory line
Probe usedProbe rotation type SG-LSGD
Main inspectionScratches, dents, rust, etc.
Inspection target diameter /
measurement length		Φ10mm　
L=10mm
Takt timeAbout 3sec

Inspection of screw holes

Inspection procedure
  1. Transport the work in the index table.
  2. Inspect 4 screw holes and judge whether each hole is OK / NG.
  3. OK products will go to the subsequent process,NG products will be re-inspected visually.

Usage environment

Device installation locationIn the factory line
Probe usedProbe rotation type SG-LSDC-2.3-50
Main inspectionContamination, screw pitch, etc.
Inspection target diameter
/ measurement length		M6mm　
L=10mm
Takt timeAbout 10sec(4 work inspection)

ANALYZER product specification

Line-up

Product name and model Photo Target bore Rotation speed Measurement length Minimum detectable size
ANALYZER3 Φ2.3
(SG-LSDC-2.3-50-10K-STD)		 Φ4 – 20 mm 10,000 rpm 50 mm 0.2 mm
ANALYZER3 Φ6
(SG-LSDC-6-203-15K-STD)		 Φ7 – 30 mm 15,000 rpm 200 mm 0.2 mm
ANALYZER3 Φ6 NEO
(SG-LSDC-6-203-18K-NEO)		 Φ7 -30 mm 18,000 rpm 200 mm 0.2 mm
ANALYZER3 Φ8
(SG-LSDC-8-190-15K-STD)		 Φ9 – 100 mm 15,000 rpm 190 mm 0.2 mm
ANALYZER3 SPⅠ
(SG-LSDC-6-203)		 Φ7 – 30 mm 15,000 rpm 200 mm 0.2 mm
ANALYZER5 Φ6
(SG-HDRM5)		 Φ7 – 100 mm 15,000 rpm 200 mm 0.2 mm

ANALYZER3 Φ2.3

This is an inner diameter inspection model for extremely thin holes with a diameter of Φ4mm or more.
This inner diameter inspection device has improved inspection accuracy, inspection speed, durability, and robustness to accommodate mass production lines.

  • Reduces labor costs
  • Stabilizes inspection quality by numerical standards
  • Prevents excessive non-returnable products due to excessive quality requirements
  • Dramatically reduces inspection time and improves work efficiency
ModelSG-LSDC-2.3-50-10K-STD
MethodOptical Scanning Method
Light sourceRed semiconductor laser (wavelength 640nm, maximum 40mW)
Laser classClass 3B
Detection componentsdirect light
Target boreΦ4 – 20 mm
Rotational speed10,000 rpm
Effective measuring length50 mm
Minimum detection size0.2 mm
Inspection speed guidelineApproximately 3 seconds *When measuring length is 50 mm and resolution is 0.1 mm
Sampling frequencyUp to 2,400 kHz
Power supply100, 200V

ANALYZER3 Φ6

This is a standard model for inner diameter inspection of holes with diameters of Φ7mm or more.
This is an inner diameter inspection device with improved inspection accuracy, inspection speed, durability, and robustness to accommodate mass production lines.

  • Reduces labor costs
  • Stabilizes inspection quality by numerical standards
  • Prevents excessive non-returnable products due to excessive quality requirements
  • Dramatically reduces inspection time and improves work efficiency
ModelSG-LSDC-6-203-15K-STD
MethodOptical Scanning Method
Light sourceRed semiconductor laser (wavelength 640nm, maximum 40mW)
Laser classClass 3B
Detection componentsDirect light
Target boreΦ7 – 30 mm
Rotational speed15,000 rpm
Effective measuring length200 mm
Minimum detection size0.2 mm
Inspection speed guidelineApproximately 4 seconds
*When the measurement length is 100 mm and the resolution is 0.1 mm
Sampling frequencyUp to 2,400 kHz
Power supply100, 200V

ANALYZER3 Φ6 NEO

This is the top-of-the-line model with improved inspection speed and minimum detectable size for inner diameter inspection of hole diameters of Φ7mm or more. This inner diameter inspection device has improved inspection accuracy, inspection speed, durability, and robustness to meet the demands of mass production lines that require stricter conditions.

  • Reduces labor costs
  • Stabilizes inspection quality by numerical standards
  • Prevents excessive non-returnable products due to excessive quality requirements
  • Dramatically reduces inspection time and improves work efficiency
ModelSG-LSDC-6-203-18K-NEO
MethodOptical Scanning Method
Light sourceRed semiconductor laser (wavelength 640nm, maximum 40mW)
Laser classClass 3B
Detection componentsDirect light
Target boreΦ7 – 30 mm
Rotational speed18,000 rpm
Effective measuring length200 mm
Minimum detection size0.2 mm
Inspection speed guidelineApprox. 3.3 seconds
*When measurement length is 100 mm and resolution is 0.1 mm
Sampling frequencyUp to 2,400 kHz
Power supply100, 200V

ANALYZER3 Φ8

This model is suitable for inspecting the inner diameter of relatively large holes with a diameter of Φ9mm or more. This is an inner diameter inspection device with improved inspection accuracy, inspection speed, durability, and robustness to be compatible with mass production lines.

  • Reduces labor costs
  • Stabilizes inspection quality by numerical standards
  • Prevents excessive non-returnable products due to excessive quality requirements
  • Dramatically reduces inspection time and improves work efficiency
ModelSG-LSDC-8-190-15K-STD
MethodOptical Scanning Method
Light sourceRed semiconductor laser (wavelength 640nm, maximum 40mW)
Laser ClassClass 3B
Detection componentsDirect light
Target boreΦ9 – 100 mm
Rotational speed15,000 rpm
Effective measuring length190 mm
Minimum detection size0.2 mm
Inspection speed guidelineApproximately 4 seconds
*When the measurement length is 100 mm and the resolution is 0.1 mm
Sampling frequencyUp to 2,400 kHz
Power supply100, 200V

ANALYZER3 SP I

This is a valve body stand-alone inspection device with a built-in SG-LSDC probe.
By simply changing the workpiece seating jig, it can be put into the production line immediately.

  • Reduces labor costs
  • Stabilizes inspection quality by numerical standards
  • Prevents excessive non-returnable products due to excessive quality requirements
  • Dramatically reduces inspection time and improves work efficiency
ModelSG-LSDC-6-203
MethodOptical Scanning Method
Light sourceRed semiconductor laser (wavelength 640nm, maximum 40mW)
Laser classClass 3B
Detection componentsDirect light
Target boreΦ7 – 30 mm
Rotational speed15,000 rpm
Effective measuring length200 mm
Minimum detection size0.2 mm
Inspection speed guidelineApproximately 4 seconds
*When the measurement length is 100 mm and the resolution is 0.1 mm
Sampling frequencyUp to 2,400 kHz
Power supply100, 200V

ANALYZER5 Φ6

In addition to the conventional ANALYZER3 cylinder inner surface defect inspection function, we have added an inner diameter/roundness measurement function! Defect inspection and inner diameter/roundness measurement can be performed simultaneously.

  • Eliminates variation in measurements between inspectors
  • Reduces the amount of work required for inspections
  • Measures inner diameter/roundness at high speed
  • Combines the defect inspection process and diameter/roundness measurement process into one
ModelSG-HDRM5
MethodOptical Scanning Method
Light sourceRed semiconductor laser (wavelength 635nm to 670nm, maximum 40mW)
Infrared semiconductor laser (wavelength 840nm to 1300nm, maximum 40mW)
Laser classClass 2-3B
Detection componentsDirect light
Target boreΦ7 – 100 mm
Rotational speed15,000 rpm
Effective measuring length200 mm
Minimum detection size0.2 mm
Inspection speed guidelineApproximately 4 seconds
*When the measurement length is 100 mm and the resolution is 0.1 mm
Sampling frequencyDefect inspection function: Up to 2,400kHz
Diameter/roundness measurement function: Up to 200kHz
Power supply100, 200V
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